BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the semiconductor and electronics industries. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. It offers products, including Die attach equipment, which include single chip, multi chip, multi module and flip chip; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals. It also offers services, such as tooling, conversion kits, spare parts and other services to its customer installed base. It also offers wire bonding equipment. Its principal operations are in the Netherlands, Austria, Switzerland, Malaysia and China.